Product range: FOUP / FOSB / SMIF Pod / Cassette Ultra-micro clean cleaning, 4‘ / 5’ / 6‘ / 8’ / 12’ wafer cassettes all covered, other types of size support custom.
Chip process: meet the process below 14nm, above 14nm process can be customised,Solving wafer cassette microparticle contamination problems and improving chip manufacturing yields.
R & D technology team focuses on clean process technology, cleaning process logic technology, molecular layer drying technology, core clean semiconductor in the 3 technology aspects of the completion of the underlying core technology data construction. And summed up the international experience, build a quality hardware environment led by self-development, self-validation - to hire an international third-party agency to test and certify and then implement the market as the basis for solving the domestic semiconductor industry in the wafer box microparticle contamination of the technical barriers to break the domestic long-term dependence on imports of wafer box clean cleaning process equipment, and the formation of the core clean semiconductor in the niche characteristics of the equipment's unique technological advantages.
Mastering the underlying technology·Manufacture of nuclear core equipment
Tel:
15796350920
XinGe SEMI