Semiconductor integrated circuits (SICs) are electronic components that integrate many components into a single chip to process and store various functions. Since semiconductor integrated circuits are created by fabricating multiple identical circuits on the thin substrate of a wafer, the wafer is the foundation of the semiconductor.

Integrated circuits in accordance with the types of products are divided into four main categories: microprocessors, memory, logic devices, analogue devices, usually we collectively call them chips. Integrated circuits are active devices, passive components and their interconnections together in the semiconductor substrate or insulating substrate, forming a structurally tightly linked, internally related instances of electronic circuits. It can be divided into semiconductor integrated circuits, membrane integrated circuits, hybrid integrated circuits three main branches. Chip (chip) is the semiconductor components of the product is collectively referred to as integrated circuits (IC, integrated circuit) carrier, divided into wafers.

FOUP and FOSB are often used in the IC wafer manufacturing process, used in all process equipment and all the storage and transport functions between factories, the main role is to keep the internal wafers and the outside world is completely isolated, the internal completely closed inert gas filled to prevent oxidation damage to the wafers to establish a micro clean space for the wafers, FOUP and FOSB in each process need to be cleaned at the end of use. FOUP and FOSB need to be cleaned at the end of each process, and have both a limited service life and strict size requirements.